Numerical Simulation of Guided Ultrasonic Waves for Inspecting Epoxy Thickness in Aluminum-Epoxy-Aluminum Adhesive Plates

J. Ocean Eng. Technol. 2009;23(6):117-123.

Lee Ju-Won,Na Won-Bae

Department of Ocean Engineering Pukyong National University,Department of Ocean Engineering Pukyong National University

알루미늄-에폭시-알루미늄 접착판에서 에폭시 두께 검사를 위한 유도초음파 수치시뮬레이션

이주원,나원배

부경대학교 해양공학과,부경대학교 해양공학과

Keywords: Numerical simulation, Guided ultrasonic waves, Aluminum-epoxy-aluminum adhesive plates

핵심용어: 수치 시뮬레이션, 유도초음파, 알루미늄-에폭시-알루미늄 접착판

Abstract

This paper presents a numerical simulation of guided ultrasonic waves propagating in aluminum-epoxy-aluminum adhesive plates. In particular, this study investigated the effect of the epoxy thickness on the dispersive patterns, such as the phase velocity and group velocity of guided ultrasonic waves. In addition to investigating the dispersive curves, a numerical simulation using the pulse-echo method was carried out. This simulation showed that the degree of sensitivity of the epoxy thickness is dependent on the curvature of the phase and group dispersion curves, the maximum amplitude of the received time signals, and the peak frequency of the real components of the Fourier transform. Then, the linear relations between the epoxy thickness and the received and transformed signals were constructed to estimate the epoxy thickness.